Influence of Bath Composition to Via-Filling by Copper Electroplating.
نویسندگان
چکیده
منابع مشابه
Electrochemical and Simulative Studies of Trench Filling Mechanisms in the Copper Damascene Electroplating Process
The role of additives in copper electroplating baths in the damascene process has been investigated. We proposed a bottom-up filling model and confirmed it by comparing the experimental and simulation results. Janus Green B and Basic Blue 3 which absorb on the copper surface and suppress copper deposition were examined for additive use to improve filling capability. Damascene copper grew unifor...
متن کاملMicrostructural Study of the Effect of Chloride Ion on Electroplating of Copper in Cupric Sulfate-Sulfuric Acid Bath
The purpose of this work is to study the electrocrystallization behavior of the copper deposit on pure titanium substrate. The electroplating was conducted at 0.7 A/cm2, 65°C in cupric sulfate-sulfuric acid bath with various chloride additions 45-350 ppm . Initial growth morphology and microstructure of the deposit were examined with a field-emission scanning electron microscope FESEM and a hig...
متن کاملthe influence of corpus luteum on follicular fluid composition from different size follicles and their relationship to serum concentrations in sanjabi ewes
the aim of the present study was to determine the in?uence of presence or absence of corpus luteum (cl) on hormonal and metabolites composition of follicular ?uid (ff) harvested from different sized follicles and its relationship with blood serum concentrations in sanjabi ewes. ovaries and blood samples were collected from 60 clinically healthy adult ewes (sanjabi breed) 1–3 years of age in dio...
Adsorption of Copper(II) from an Wastewater Effluent of Electroplating Industry by Poly(ethyleneimine)-Functionalized Silica
The poly(ethyleneimine)-functionalized silica has been developed successfully as an effective adsorbent for the adsorption removal of Cu(II) ions from electroplating wastewater. The influences of pH, contact time and initial concentration of Cu(II) ions on the adsorption capacity and the effect of adsorbent dosage on the removal efficiency of Cu(II) ions from electroplatin...
متن کاملBiosortion of Copper from Electroplating Effuluent and It’s Equilibrium Studies
The present work is concerned to remove Cu using the biosorption potential of fungal biomass Aspergillus oryzae. The dry fungal biomass was used to optimize various parameters such as contact time, initial metal ion concentration, pH, biomass loading etc. A maximum of 91% Copper removal was observed in 5 mg/L initial Copper metal ion concentration using dry Aspergillus oryzae biomass. The perce...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Journal of Japan Institute of Electronics Packaging
سال: 2000
ISSN: 1343-9677,1884-121X
DOI: 10.5104/jiep.3.324